High and low temperature testing is the abbreviation for high temperature testing and low temperature testing. The purpose of the test is to determine the adaptability of products for storage, transportation, and use under high or low temperature climate environmental conditions. The severity of the test depends on the temperature and exposure duration at high or low temperatures.
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The purpose of constant temperature and humidity testing is to understand the performance changes of products under set constant temperature and humidity conditions. It aims to identify various defects in product design, materials, and processes as early as possible. Through analysis and improvement, product reliability can be gradually enhanced to eventually meet the predetermined design level. It provides information to improve product operational readiness, increase mission success rates, and reduce maintenance costs. It also confirms whether the product meets the specified quantitative requirements under given temperature and humidity conditions.
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Temperature and Humidity Cycling (High-Low Temperature Damp Heat) testing is used to evaluate the performance of various products (such as aerospace products, electronic instruments, materials, electrical and electronic components, etc.) under combined temperature and humidity conditions. The temperature and humidity are not held constant but vary in a cyclical pattern. The test typically involves multiple cycles.
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The Rapid Temperature Change Test simulates a process of abrupt temperature change, similar to a thermal shock test. The test cycle consists of: ambient temperature → low temperature → low temperature dwell → high temperature → high temperature dwell → ambient temperature. The rapid temperature change rate measures the severity of the temperature change. Its harshness is determined by the high/low temperature range, dwell time, and number of cycles. The current BTS rapid temperature change test chamber can achieve a maximum temperature change rate of 25°C/min.
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Thermal shock test, also known as temperature shock test or high-low temperature impact test, involves exposing test samples alternately to low and high-temperature air (or suitable inert gas) to subject them to the effects of rapid temperature changes. It is used to determine the ability of components, equipment, and other products to withstand rapid changes in environmental temperature. This test assesses a product's adaptability to abrupt changes in ambient temperature and is an essential test in the qualification testing of equipment design and routine testing during batch production stages. In some cases, it can also be used for environmental stress screening. It can be said that the application frequency of thermal shock test chambers in verifying and improving the environmental adaptability of equipment is second only to vibration and high-low temperature tests.
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Low-pressure testing is mainly used in the aviation, aerospace, information technology, and electronics fields. It determines the environmental adaptability and reliability testing of instruments, electrical products, materials, components, and equipment under low pressure, high temperature, low temperature, or combined effects. It may also measure electrical performance parameters while powering the test sample.
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